Welcome to 7th ICMEM
2023 7th International Conference on Material Engineering and Manufacturing (ICMEM 2023) will be held in Chiba University, Chiba, Japan during April 7-10, 2023.
ICMEM 2023 is co-sponsored by Chiba University, Japan and Kwansei Gakuin University, Japan. The main aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Materials Engineering and Manufacturing. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Materials Engineering and Manufacturing.
Notice: The ICMEM conference Organizing Committee remains vigilant in monitoring the COVID-19 pandemic. ICMEM 2023 is planned as a hybrid format with both onsite and virtual options that will allow participants who, for a variety of reasons, may not be able to join the in-person conference in Chiba, Japan.
Proceedings
Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection. Papers will be sent for indexing by Ei Compendex, Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.
☆ Retrieval information is extracted from the journal official website. ICMEM provides opportunities for academic exchanges, the conference could not guaranttee on future retrieval status. Please be aware of this before submission.
The publisher will check every paper during pre-production procedure. Your paper will be published in either one of the below journals according to your paper topic.
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| Defect and Diffusion Forum (DDF) ISSN print 1012-0386 ISSN web 1662-9507 |
Solid State Phenomena (SSP) ISSN print 1012-0394 ISSN web 1662-9779 |
Materials Science Forum (MSF) ISSN print 0255-5476 ISSN web 1662-9752 |
Key Engineering Materials (KEM) ISSN print 1013-9826 ISSN web 1662-9795 |
※ ICMEM 2022: Materials Science Forum (publication in progress...)
※ ICMEM 2021:
Vol.
324.
Solid
State
Phenomena-ISBN:
978-3-0357-1859-1-Online Linkage |
Indexed
by
Ei Compendex & Scopus
※ ICMEM 2020:
Vol.
1009, Materials Science Forum-ISBN:
978-3-0357-1688-7-Online Linkage |
Indexed
by
Ei Compendex & Scopus
※ ICMEM 2019:
Vol.
976, Materials Science Forum-ISBN:
978-3-0357-1518-7-Online Linkage |
Indexed
by
Ei Compendex & Scopus
※ ICMEM 2018: Vol. 932, Materials Science Forum-ISBN:
978-3-0357-1395-4-Online Linkage |
Indexed
by
Ei Compendex & Scopus
※ ICMEM 2017: Vol.
265,
IOP
Conference
Series:
Materials
Science
and
Engineering-Online Linkage |
Indexed
by
Ei Compendex & Scopus
Important Dates
November 20, 2022
Submission Deadline
December 15, 2022
Notification Deadline
December 30, 2022
Registration Deadline
ICMEM 2022 Speakers
Dr. A.P. Zhukov is Ikerbasque Research professor at the Advanced Polymers and Materials of the University of Basque Country, Spain. He has published more than 600 referred papers in the international journals (total number of citations of A. Zhukov’s papers, updated October 12, 2020: 9024, Citation H-index = 51). He is an associate Editor of IEEE Magnetic letters and International Journal on Smart Sensing and Intelligent Systems.
Dr. Zongjin LI is Chair professor at Institute of Applied Physics and Materials Engineering at University of Macau (UM). He joined UM after his service Hong Kong University of Science and Technology from 1994 to 2016. He received the Arthur R. Anderson Medal from American Concrete Institute in 2017 and Distinguished Visiting Fellowship Award from British Royal Academy of Engineering in 2014.
Masahiro Nomura is an Associate Professor in Institute of Industrial Science, The University of Tokyo. He received Ph.D. degree in Applied Physics in 2005, respectively, from The University of Tokyo. His current research interests include hybrid quantum science, physics and controlling technology of phonon/heat transport in semiconductor nanostructures, and energy harvesting by thermoelectrics.
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